| abstract |
The object of the present invention is to provide a photosensitive resin composition that can obtain a cured film with high reliability and excellent bending properties, excellent processability of concave and convex patterns, and sufficient light diffusibility. In order to achieve the above object, the photosensitive resin composition of the present invention contains (A) a silicone resin, (B) particles with a median diameter of 0.2 to 0.6 μm, and (C) a photosensitive compound of naphthoquinonediazide A resin composition, wherein the (A) silicone resin contains at least a total of 20-60 mol% of the repeating unit represented by the following general formula (1). (R 1 represents an aryl group having 6 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms in which all or part of hydrogen is substituted). |