http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202114102-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ddbd9538efce6e134d471b912946264e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a2663285cd64287507da33359904497 |
| publicationDate | 2021-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202114102-A |
| titleOfInvention | Package structure and method of forming the same |
| abstract | A package structure and method of forming the same. The package structure includes a die, a redistribution structure and a conductive pad. The redistribution structure is disposed on and electrically connected to the die. The redistribution structure includes a dielectric film, a conductive line, an adhesion layer and a conductive via. The dielectric film has a first surface and a second surface opposite to each other. The conductive line and the adhesion layer are located between the first surface of the dielectric film and the die. The conductive line is electrically connected to the die, and the adhesion layer laterally surrounds the conductive line. The conductive via penetrates through the dielectric film and the adhesion layer to electrically connect to the conductive line. The conductive pad is electrically connected to the die through the redistribution structure. |
| priorityDate | 2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.