| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_599f2f570b3a989fa9076f8465318ddc |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G75-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 |
| filingDate |
2020-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c921f02f91bde5885ae49540a61f48e |
| publicationDate |
2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202110961-A |
| titleOfInvention |
Thermal interface materials |
| abstract |
A two-part thermal interface material based on a polysulfide resin and a plurality of thermally conductive fillers dispersed throughout the polysulfide resin is disclosed. The polysulfide resin has a comb-like structure: the main backbone is formed with acrylate-thiol linkages, and the pendent comb structure is formed through a thiol-acrylate reaction. The two-part thermal interface material is particularly useful as gap fillers to dissipate heat and to provide consistent performance and long-term reliability for heat generating electronic devices. |
| priorityDate |
2019-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |