| abstract |
The subject of the present invention is to provide a thermosetting composition, semi-cured or cured product, semiconductor sealing material, semiconductor device, insulating material, and printed wiring board that can achieve low thermal expansion. The thermosetting composition of the present invention is a thermosetting composition comprising a thermosetting resin, a thermosetting agent, a modified resin, and one or more types selected from the group consisting of inorganic particles and fibers, and is characterized in that: The modified resin is a thermoplastic resin having at least one selected from the group consisting of a hydroxyl group and a carboxyl group, and the glass transition temperature of the modified resin is -100°C or more and 50°C or less. The number average molecular weight is 600 or more and 50,000 or less, and the content of one or more selected from the group consisting of inorganic fine particles and fibers is 40% by mass or more in the non-volatile content. |