| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f3518dca003902d9f332ad08ac9a6ffe |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05547
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05546
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14643
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14643
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1469
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N25-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14634 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-369
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-335
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate |
2019-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cec8dad719c1bef7e809a2fa0f59873 |
| publicationDate |
2021-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202109747-A |
| titleOfInvention |
Semiconductor devices and electronic equipment |
| abstract |
The present invention provides a semiconductor device and an electronic device that can improve the adhesion between a first electrode portion and a second electrode portion facing each other. The semiconductor device includes: a first wiring portion; a first interlayer insulating film covering one surface side of the first wiring portion; a first electrode portion provided in a first through hole provided on the first interlayer insulating film, and The first wiring portion is electrically connected; the second wiring portion; the second interlayer insulating film, which covers the side of the second wiring portion opposite to the first wiring portion; and the second electrode portion, which is provided on the second interlayer insulation The second through hole provided on the film is electrically connected to the second wiring part. The first electrode portion and the second electrode portion are directly joined to each other. The coefficient of thermal expansion of the first electrode portion is greater than the coefficient of thermal expansion of the first wiring portion. |
| priorityDate |
2018-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |