http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202105500-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
filingDate 2020-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_099a06eda8bd8990072127bcb73d95e7
publicationDate 2021-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202105500-A
titleOfInvention Metal removal method, dry etching method, and manufacturing method of semiconductor element
abstract To provide a metal removal method that can be implemented at low cost. The metal removal method of the present invention includes a reaction step of contacting the processing gas of the fluorine-containing interhalogen compound with the metal-containing material containing the metal element to produce the reaction product of the fluorine-containing halogen compound and the metal element, that is, the metal fluoride, and The volatilization step of heating the metal fluoride to volatilize under an inert gas atmosphere or a vacuum environment. The metal element is at least one selected from the group consisting of iron, cobalt, nickel, selenium, molybdenum, rhodium, palladium, tungsten, rhenium, iridium, and platinum.
priorityDate 2019-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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