| abstract |
The subject of the present invention is to provide a curable resin composition that is excellent in curability by light irradiation and heating, and is suitable for applications such as liquid sealants, liquid adhesives, adhesives for camera modules, liquid crystal sealants, and the like.nThe present invention is composed of (A) aromatic epoxy resin with allyl group, (B) mercaptan hardener, (C) photo-radical initiator and (D) thermal latent hardener Curable resin composition. (A) The compound having an allyl group and an epoxy group is preferably an aromatic epoxy resin having an allyl group. The mercaptan-based hardener as the component (B) is preferably liquid at 25°C. |