| abstract |
The subject of the present invention is to provide a lead frame, which is a lead frame in which silver plating is applied to the upper surface and the side surface as the outermost layer of the upper surface, side surface, and lower surface of the lead frame base material, which can reduce cost and operating time , Improve productivity, while suppressing the thickness of the entire plating layer including the silver plating layer to be thin, and significantly improve the adhesion to the sealing resin. The solution is to provide a roughened silver plating layer (11) with needle-like protrusion groups on the upper surface, side surface, and lower surface of the lead frame base material (10) made of copper-based material as the outermost layer The roughened silver plating layer has a crystal structure with the highest ratio of crystal orientation <101> among the respective ratios of crystal orientations <001>, <111>, and <101>. |