http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202100711-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76819 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
filingDate | 2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5cfb03752488ecb5a5bcd38cea5c908 |
publicationDate | 2021-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-202100711-A |
titleOfInvention | Polishing composition, method for polishing and method for manufacturing substrate |
abstract | [Technical Problem] A polishing composition is provided, which can make the removal rate of metal materials the same as or similar to that of resin materials in the chemical mechanical polishing process, thereby avoiding or suppressing the generation of step differences. [Technical Means] The polishing composition of the present invention includes: abrasive grains, wherein the abrasive grains contain silicon dioxide, and at least a part of the hydrogen atoms constituting the silanol group on the surface of the silicon dioxide are replaced by cations of metal atoms M , Wherein the metal atom M is at least one selected from the group consisting of aluminum, chromium, titanium, zirconium, iron, zinc, tin, scandium and gallium; and a dispersion medium, wherein the pH of the polishing composition The value is greater than 2 and 7 or less. |
priorityDate | 2019-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 525.