| abstract |
The present invention provides a cleaning agent composition and cleaning method, which are used for cleaning semiconductor substrates and other substrates, for example, for temporary bonding and peeling of bonding layers obtained by using polysiloxane-based adhesives After the adhesive residue, good cleaning performance can be obtained, and the substrate can be cleaned efficiently without corroding the substrate.nn n n The aforementioned detergent composition is a detergent composition used to remove adhesive residues, which contains a quaternary ammonium salt and a solvent; and the aforementioned solvent is composed of only organic solvents; the aforementioned organic solvent contains N ,N,N',N'-Tetra (hydrocarbon) urea. |