| abstract |
The resin composition of the present invention contains a pigment, a resin and a solvent. When the resin composition is heated at 200°C for 30 minutes to form a film with a thickness of 0.60 μm, the film is heated at 300°C for 5 hours in a nitrogen atmosphere. The change rate ΔA of the absorbance represented by the formula (1) of the treated film is 50% or less. Films, color filters, solid-state imaging devices, and image display devices using resin compositions. In the following formula, ΔA is the rate of change in the absorbance of the film after the heat treatment, A1 is the maximum absorbance of the film before the heat treatment in the wavelength range of 400 to 1100 nm, and A2 is the absorbance of the film after the heat treatment. It is the absorbance at the wavelength that represents the maximum absorbance of the film before the heat treatment in the wavelength range of 400 to 1100 nm.nΔA=|100-(A2/A1)×100| ･･･(1) |