| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8553733a3c1342775263026d3e90631c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02331
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1421
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02372 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03F3-213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03F3-189 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-535
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2019-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35a40bb48c2d03fb88568c78159603c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69ed715102ebc6397960bcf777b626f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e75a89ddc4e6836f4db64c5a09efe00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5091649c584df8c0d55eaef21ce0a57b |
| publicationDate |
2020-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202044526-A |
| titleOfInvention |
Semiconductor integrated circuit and circuit layout method thereof |
| abstract |
A semiconductor integrated circuit includes a semiconductor substrate, a front metal layer, a sub-metal layer and a back metal layer. The semiconductor substrate has a substrate through hole, an upper surface and a lower surface. The front metal layer is formed on the upper surface of the semiconductor substrate. The substrate through hole has an inner surface. The inner surface of the substrate through hole includes a bottom and one side. The bottom of the inner surface of the substrate through hole is at least partially defined by the front metal layer. The sides of the inner surface of the substrate through hole are at least partially defined by the semiconductor substrate. The seed metal layer is formed on the inner surface of the through hole of the substrate and the lower surface of the semiconductor substrate to connect the seed metal layer with the front metal layer. The seed metal layer has an outer surface. The back metal layer is formed on the outer surface of the seed metal layer. The aspect ratio of one of the through holes of the substrate is greater than or equal to 0.2 and less than or equal to 3, thereby improving the thickness uniformity of one of the back metal layers. |
| priorityDate |
2019-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |