http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202043369-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 |
| filingDate | 2020-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_098746c10d04a241448120181799762b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aac80d1b4d4bc6484f2b8983ee300b04 |
| publicationDate | 2020-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202043369-A |
| titleOfInvention | Non-curing thermally conductive silica composition |
| abstract | The present invention is a non-curing thermally conductive silicone composition characterized by containing the following (A) to (C) components as essential components, and the molecular weight distribution Mw/ of the mixture of the (A) component and the (B) component Mn is 10 or more; (A) Organopolysiloxane, which has a dynamic viscosity of 1,000,000 mm 2 /s or more at 25°C; (B) Hydrolyzable organopolysiloxane represented by the following general formula (1) Compound, In the formula (1), R 1 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms that may have a substituent, and m is an integer of 5 to 100; (C) a thermally conductive filler; wherein, with respect to (A) component and ( B) The total amount of components, the blending amount of (A) component is 5-20% by mass, the blending amount of (B) component is 80-95% by mass, and the blending amount of (C) component is relative to the entire composition. The amount is 10 to 95% by mass. Thereby, there is provided a non-curable thermally conductive silicone composition, which contains a large amount of thermally conductive filler but still maintains an appropriate viscosity, has excellent coating workability, and has good extraction resistance. |
| priorityDate | 2019-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.