Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-63 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D11-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-02 |
filingDate |
2020-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3431c06e8d4bb18a1a014ebe017d626 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da9aa351007eb817c688a2d5911704c8 |
publicationDate |
2020-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-202041723-A |
titleOfInvention |
Copper surface processing device |
abstract |
A copper surface processing device is for processing the surface of an object covered by copper. The processing device is provided with: a first groove for oxidizing the surface; and a second groove for processing the oxidized surface Electroplating treatment. |
priorityDate |
2019-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |