| abstract |
The present invention provides a photosensitive resin composition which can form a resin film pattern having excellent development adhesion and linearity, solvent resistance, alkali resistance, and the like even when a substrate with low heat resistance is used. The photosensitive resin composition of the present invention is a photosensitive resin composition for forming a cured film on a substrate with a heat-resistant temperature of 140°C or less, and contains: (A) an unsaturated group-containing alkali-soluble resin; (B) A photopolymerizable monomer having at least two ethylenically unsaturated bonds, (C) an epoxy compound having two or more 3,4-epoxycyclohexyl groups, (D) a photopolymerization initiator, and (E) Solvent. The content of the component (C) is 5% by mass to 17% by mass relative to the total mass of the solid content. |