| abstract |
The present invention provides a polyphenylene ether resin composition that can impart a cured product with excellent dielectric properties and improved adhesion to copper foil. The polyphenylene ether resin composition contains a polyphenylene ether resin and a silane modified copolymer represented by the following formula (1). (In the formula, R 1 independently represents an alkyl group with 1 to 10 carbons or an aryl group with 6 to 10 carbons, and R 2 independently represents an alkyl group with 1 to 10 carbons or an aryl group with 6 to 10 carbons, e, f, g, and h independently represent a number greater than 0, m represents an integer from 1 to 3, but the order of each repeating unit is arbitrary). |