| abstract |
According to the present invention, a resin composition for sealing is provided, which contains: (A) an epoxy resin; (B) a hardener; and (C) a filler. The epoxy resin (A) contains an epoxy resin having a naphthyl ether skeleton. For resin (A-1), the glass transition temperature of the cured product of the sealing resin composition is set to Tg (°C), the linear expansion coefficient at 190°C to 230°C is set to α 2 (ppm/°C), and the When the thermal elastic modulus at 260°C is set to E 2 (MPa) and the rectangular pressure of the sealing resin composition measured by the following method at 175°C is set to η 2 (MPa), the following formula (1 ). Formula (1) E 2 ×(α 2 ×10 -6 )×(175-Tg)×η 2 ≤0.3 (Method) Use a low-pressure transfer molding machine at a mold temperature of 170°C and an injection flow rate of 177mm 3 /sec. Next, the sealing resin composition was injected into a rectangular flow path with a width of 15 mm, a thickness of 1 mm, and a length of 175 mm, and the pressure sensor was embedded at a position 25 mm away from the upstream end of the flow path to measure the change over time. And measure the minimum pressure (MPa) when the resin composition for sealing is flowing, and use it as a rectangular pressure. |