| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c88c465202a4bc7d8388cca9c9bf52 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-10148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-30148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-20224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T2207-10152 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T5-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T7-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T5-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-8806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-9501 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-956
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T7-00 |
| filingDate |
2019-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dde90800ac1b0eb32cb7e36329ff65e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_567e7ca493eb2a7e8cf5cccbd3864a86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89f28d4d322f5e8f5312c3745d039fff |
| publicationDate |
2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202037903-A |
| titleOfInvention |
Differential imaging for single-path optical wafer inspection |
| abstract |
Methods and systems for enhanced defect detection based on images collected by at least two imaging detectors at different times are described. In some embodiments, the time between image measurements is at least 100 microseconds and no more than 10 milliseconds. In one aspect, one or more defects of interest are identified based on a composite image of a measured area generated based on a difference between collected images. In a further aspect, measurement conditions associated with the each imaged location are adjusted to be different for measurements performed by at least two imaging detectors at different times. In some embodiments, the measurement conditions are adjusted during the time between measurements by different imaging detectors. Exemplary changes of measurement conditions include environmental changes at the wafer under measurement and changes made to the optical configuration of the inspection system. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I808707-B |
| priorityDate |
2018-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |