| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_deb5da9d0a5c03c51dd312114fcec9e7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2310-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2248 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-07 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-00 |
| filingDate |
2020-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4930db624ed3e2ca7d0f886b54e1a229
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f5fbab8821beb5a56f165524666345c |
| publicationDate |
2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202037659-A |
| titleOfInvention |
Polyamides having high levels of amine end groups |
| abstract |
A heat-stabilized polyamide composition comprising from 25 wt% to 99 wt% of an amide polymer having an amine end group level greater than 50 [mu]eq/gram; a first stabilizer comprising a lanthanoid-based compound; a second stabilizer; and from 0 wt% to 65 wt% filler; wherein, when heat aged for 3000 hours over a temperature range of from 190 DEG C to 220 DEG C, the polyamide composition demonstrates a tensile strength retention of greater than 51%, as measured at 23 DEG C. |
| priorityDate |
2019-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |