http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202037621-A

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filingDate 2019-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcb51bf2879a30f4c6269256995a18e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c16265271989730784a737c9e206177
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publicationDate 2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202037621-A
titleOfInvention Polymer, conductive paste composition, binder resin for ceramics, ceramic slurry composition and binder resin for conductive paste
abstract The present invention provides a polymer capable of providing a paste. The paste has excellent thixotropy, no drawing or bleeding during printing, and excellent thermal decomposition. In the polymer, the molar ratio of the monomer (A) represented by formula (1) is 10 mol% to 100 mol%, and the molar ratio of other monomers (B) copolymerizable with the monomer (A) is 0 ~90 mol%, the weight average molecular weight of the polymer is 10,000~1,000,000. R 1 represents a hydrogen atom or a methyl group, R 2 represents an alkyl group with 1 to 18 carbon atoms or a hydroxyalkyl group with 1 to 18 carbon atoms, and A represents an alkylene group with 1 to 10 carbon atoms , X represents 0 or 1, and Y 1 is one or more structures selected from the group consisting of hydroxyurethane structures of formula (2) and formula (3).
priorityDate 2019-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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