| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74dc1c969fa5c34111b515ddcb8db690 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 |
| filingDate |
2019-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dfc04b885bedab4194761f6e392bd06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5bfba0102bd73bdb01ce07e4d455f50b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f88414c4f1caf18e30ef4e9cd687248e |
| publicationDate |
2020-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202035620-A |
| titleOfInvention |
Adhesive tape and manufacturing method of semiconductor package |
| abstract |
A subject of the disclosure is to provide an adhesive tape and a manufacturing method of a semiconductor package using the adhesive tape, wherein the adhesive tape can be peeled cleanly from a lead frame without leaving a part of an adhesive layer and can prevent mold flash. The subject can be solved by an adhesive tape for use in a manufacturing method of a semiconductor package, wherein the adhesive tape includes a substrate and an adhesive layer disposed on the substrate, and the adhesive layer includes a non-aromatic acrylic polymer that is crosslinked by a metal chelate crosslinking agent. |
| priorityDate |
2018-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |