Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e1bf06f55de84b78abc9a057807f7eb |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2367-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-243 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-244 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
filingDate |
2020-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8da15cf448c7b6d3eeb8e919c73eb91 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7452feb04b2df474f397673b7ae43942 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddf10867c92c81782a8617e32a7f9068 |
publicationDate |
2020-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-202035503-A |
titleOfInvention |
Epoxy Resin Solution |
abstract |
The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11753502-B2 |
priorityDate |
2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |