| abstract |
The object of the present invention is to provide an electronic component with strong adhesion between the copper electrode and the inorganic substrate.nThe manufacturing method of the electronic part of the present invention includes a coating step, which is to coat a paste containing copper particles, copper oxide particles and/or nickel oxide particles and inorganic oxide particles with a softening point on an inorganic substrate The sintering step, which is under an inert gas atmosphere, is heated at a temperature that does not reach the softening point of the inorganic oxide particles and above the sintering temperature of the copper particles to form a sintered body containing at least copper; and a softening step, which is In an inert gas atmosphere, heating is performed at a temperature above the softening point of the inorganic oxide particles. |