| abstract |
The subject of the present invention is to provide a curable resin composition in which the bubbles generated in the film of the curable resin composition coated on the substrate are easy to escape, heat resistance, dryness, electroless gold plating, heat resistance, flexibility and bending Excellent foldability.nThe solution is a curable resin composition containing (A) alkali-soluble resin, (B) photopolymerization initiator, (C) a compound having two ethylenically unsaturated groups with a molecular weight of 300-1000 and ( D) The curable resin composition of the thermosetting component, and 0.2ml of the aforementioned curable resin composition is clamped between two stainless steel plate sensors with a diameter of 35mm, and placed at 25°C for 60 seconds. When the shear stress changes from 0.0001Pa to 1.0E+4Pa, the viscosity change is below 20Pa. |