| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2020-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb2506997edc0734a6fc0f171b663ea7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db48e1b285f38010aeb02dc548d1e5a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e748ed80a289096f3f1d3b7dab19b212 |
| publicationDate |
2020-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202033834-A |
| titleOfInvention |
Copper or copper alloy electroplating bath |
| abstract |
The present invention provides a copper or copper alloy electroplating bath, which is compounded with two or more electrolytes, and the electrolyte contains at least one of nitric acid and nitrate. By using this copper or copper alloy electroplating bath, it is possible to form electrodeposits such as a bump electrode group having a large aspect ratio and a uniform height or thickness at high speed. |
| priorityDate |
2019-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |