| abstract |
An object of the present invention is to provide a random copolymer compound which has excellent heat-forming properties and high heat resistance, and low dielectric constant and dielectric loss tangent while nhaving excellent film forming ability, and a terminal-modified polymer compound. That is, the present invention discloses a random copolymer compound which is a random copolymer of (A) a polyphenylene ether resin having a phenolic hydroxyl group at both ends, (B) an aliphatic polymer having an alcoholic hydroxyl group at both ends, and (C) an acid dichloride compound as a binder, wherein the number of moles a of the (A) polyphenylene ether resin, the number of moles b of the (B) aliphatic polymer and the number of moles c of the (C) acid dichloride compound as the binder satisfie the relationship (a + b)> c. |