| abstract |
The subject of the present invention is to provide a photosensitive resin composition, a dry film obtained by using the composition, and a pattern forming method. The photosensitive resin composition has good storage stability and can provide easy pattern formation. Substrates, electronic parts, semiconductor elements, etc., especially the adhesion of substrates used in circuit boards and other thin film properties, and excellent reliability as a film for protecting electrical/electronic parts or a film for bonding substrates, etc., especially copper migration resistance , And a highly reliable film.nThe solution of the present invention is a photosensitive resin composition comprising (A) a polysiloxane resin having an epoxy group and/or a phenolic hydroxyl group, (B) a photoacid generator, and (C) a composition having a dinitrogen At least one selected from organic salts of heterobicycloundecene, diazabicyclononene, diazabicycloundecene derivatives as cationic species, and organic salts having diazabicyclononene derivatives as cationic species Hardening accelerator. |