| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_49f04b1dc6b9fcc2d8b159c5ebee364b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-56 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0876
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0884
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K37-0235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0823
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-042 |
| filingDate |
2019-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64a473fa185925306776a872c44a18d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_384c3727933ebbaa4563ebdb34ea55ab |
| publicationDate |
2020-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202023723-A |
| titleOfInvention |
Laser processing device and laser processing method |
| abstract |
The laser processing device is provided with a support part, an irradiation part, a moving mechanism, a control part, and a processing state monitoring part. The processing state monitoring unit monitors whether the processing state is the first cutting state when the modified area is formed along one processing line and/or monitors whether the processing state is changed along the processing line with a plurality of parallel lines arranged side by side. In the case of the quality area, whether the processing state is the second cutting state. The first cutting state is the state where the cracks extending from the plurality of modified points contained in the modified area extend in the direction along a processing line; 2 The cutting state is a state in which the cracks extending from the plurality of modified points contained in the modified area extend in the direction along the parallel line and the direction intersecting the parallel line. |
| priorityDate |
2018-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |