| abstract |
The present invention is a thermally conductive silicone composition containing: 100 parts by mass of (A) organopolysiloxane, which has at least 2 alkenyl groups in one molecule; (B) organohydrogenpolysiloxane, which has at least Two hydrogen atoms directly bonded to the silicon atom, the amount of the (B) component is the molar number of the hydrogen atom directly bonded to the silicon atom becomes the molar number of the alkenyl group derived from the (A) component 2800-4000 mass parts of (C) thermally conductive filler, which contains a mixture of 50% by mass or more aluminum hydroxide, the mixture is 25-35% by mass with an average particle size of 0.1 A mixture of aluminum hydroxide having an average particle size of 40 μm or more and 100 μm or less of 65 to 75% by mass; (D) platinum group metal-based hardening catalyst, which is relative to component (A) , In terms of the mass of platinum group metal elements, it is 0.1 to 1000 ppm. Thereby, a thermally conductive silicon oxide composition and a cured product thereof are provided. The thermally conductive silicon oxide composition can obtain a thermally conductive silicon oxide cured product with thermal conductivity and light weight. |