| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00198
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00222 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 |
| filingDate |
2019-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc5b578d743810adf3ab40cd255f96e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44abbaa7d7fb0bf5ca221b5ab0b16048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_073489e8aa45db09aebcf72fc785e62a |
| publicationDate |
2020-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202017850-A |
| titleOfInvention |
Microelectromechanical systems and manufacturing method thereof and manufacturing method of integrated chip |
| abstract |
Various embodiments of the present disclosure are directed towards a method for forming an integrated chip including an epitaxial layer overlying a microelectromechanical systems (MEMS) substrate. The method includes bonding a MEMS substrate to a carrier substrate, the MEMS substrate includes monocrystalline silicon. An epitaxial layer is formed over the MEMS substrate, the epitaxial layer has a higher doping concentration than the MEMS substrate. A plurality of contacts are formed over the epitaxial layer, the plurality of contacts respectively form ohmic contacts with the epitaxial layer. |
| priorityDate |
2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |