| abstract |
The invention uses a polyurethane for polishing layer, which is used as the material of the polishing layer of the polishing pad, and belongs to a polyurethane raw material containing high molecular diol, organic diisocyanate and chain extender The thermoplastic polyurethane of the reactant, wherein the chain extender contains 50% by mass or more of the first chain extender containing a linear carbon skeleton having 7 to 12 carbon atoms. |