| abstract |
An adhesive composition comprising: (A) a bismaleimide resin represented by the following general formula (1), (B) an epoxy resin represented by the following general formula (2), and (C) Hardening accelerator; In the general formula (1), R 1 represents a divalent hydrocarbon group derived from a dimer acid, and Q represents a substituted or unsubstituted aliphatic group having 1 to 100 carbon atoms, a substituted or unsubstituted aromatic group, Or a substituted or unsubstituted heterocyclic aromatic group, n represents an integer of 0-100; In the general formula (2), R 2 represents a hydrogen atom or a methyl group, and m represents an integer of 0-30. |