abstract |
The object of the present invention is to provide a resin composition capable of obtaining a hardened product having a low dielectric tangent and excellent insulation reliability after a high temperature and high humidity environment test; a resin sheet containing the resin composition; A printed wiring board and a semiconductor device formed of an insulating layer formed of the resin composition.nThe resin composition of the present invention that solves the problem includes: (A) an epoxy resin, (B) a hardener, (C) a styrene-based elastomer, and (D-1) a resin having a (meth)acryloyl group . |