| abstract |
The present invention provides a photosensitive radiation-sensitive or radiation-sensitive resin composition, a resist film using the above composition, a pattern forming method, and a method of manufacturing an electronic component, the photosensitive radiation-sensitive or radiation-sensitive resin composition containing Resin (A), solvent (B), and photoacid generator. Resin (A) contains non-acid-decomposable repeating units (a1) derived from monomers having a glass transition temperature of 50°C or less when used as a homopolymer, And a repeating unit (a2) having an acid-decomposable group, and including a repeating unit having an aromatic ring, the solvent (B) has a boiling point of 135° C. or less and a viscosity of 1.5 mPa·s or less. |