| abstract |
A method of fabricating integrated circuit includes forming a metal-containing material layer over a substrate, patterning the metal-containing material layer, where the patterned material layer has an average roughness, and electrochemically treating the patterned metal-containing material layer to reduce the average roughness. The treatment may be implemented by exposing the patterned metal-containing material layer to an electrically conducting solution, and applying a potential between the patterned metal-containing material layer and a counter electrode exposed to the electrically conducting solution, such that the treating reduces the average roughness of the patterned metal-containing material layer. The electrically conducting solution may include an ionic compound dissolved in water, alcohol, and/or a surfactant. |