http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202009330-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a7d68c0925ad0c9068f497500f781377 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P10-20 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 |
| filingDate | 2019-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4536de4acc945e75838110aaf0230f99 |
| publicationDate | 2020-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202009330-A |
| titleOfInvention | Method and device for producing electroplating solution or electroplating replenishing solution of insoluble anode acidic copper plating process |
| abstract | The invention discloses a method for producing an electroplating solution or electroplating replenishing solution for an insoluble anode acid copper electroplating process, which includes the following steps: (1) setting up an electrolytic cell, and using an electrolytic cell diaphragm to separate the electrolytic cell into an electrolytic anode area and an electrolytic cathode area; (2) Prepare anolyte and catholyte separately; (3) Add anolyte to the electrolytic anode zone, add catholyte to the electrolytic cathode zone; (4) Add the electrolytic anode Immerse in the anolyte; immerse the electrolytic cathode in the catholyte; (5) Connect the electrolytic anode and cathode to the positive and negative poles of the electrolytic power supply, respectively, and turn on the electrolytic power supply When the power is turned on, the electrolytic reaction starts, and when the copper ion concentration in the anolyte reaches a predetermined value, the anolyte is taken out. The invention also discloses a device for realizing the production method of the electroplating solution or electroplating replenishing solution suitable for the above-mentioned insoluble anode acid copper electroplating process. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112553665-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113818055-A |
| priorityDate | 2018-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.