| abstract |
Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains:n(A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25℃;n(B) a silicone-modified epoxy resin;n(C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups;n(D) an organic filler; andn(E) an anionic curing accelerator. |