| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 |
| filingDate |
2019-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56d4f35d402d3dbfe50b8f389c1659f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e19c8cb0e6336fc11e9febb94f4e733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_256bb5b38edb89e86e6c52422cbf879f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67cc6cfd9b29a37d5534f41538248bc2 |
| publicationDate |
2020-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202005904-A |
| titleOfInvention |
Electrical contact-connection, method for producing an electrical contact-connection, system |
| abstract |
Electrical contact-connection (1) between a redistribution wiring (2) and a conductor region (3), wherein the conductor region (3) is arranged in a conductor layer (4) above an SOI wafer (5) or SOI chip (5), wherein a cover layer (6) is arranged above the conductor layer (4) and below the redistribution wiring (2), characterized in that the cover layer (6) has a contact-connection region (7), wherein the contact-connection region (7) is insulated from the rest of the cover layer (6) with the aid of a first cutout arrangement (8), wherein an opening (9) is formed at least in the contact-connection region (7), wherein a metallic material (10) is arranged in the opening (9), wherein the metallic material (10) connects the redistribution wiring (2) and the conductor region (3). |
| priorityDate |
2018-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |