| abstract |
The present invention is to provide a resist having a high etching resistance, a good dry etching rate ratio and an optical constant, and can form a flattening film having a good covering property and a smaller difference in film thickness after embedding even for a substrate with a high difference in height The primer film forms a composition. In addition, a method for manufacturing a polymer suitable for the resist underlayer film forming composition, a resist underlayer film using the resist underlayer film forming composition, and a method for manufacturing a semiconductor device are provided.nThe resist underlayer film forming composition is a reaction product containing: an aromatic compound (A) having 6 to 60 carbon atoms and a carbonyl group possessed by a cyclic carbonyl compound (B) having 3 to 60 carbon atoms, And a solvent; in the reaction product, one carbon atom of the cyclic carbonyl compound (B) is linked to two of the aromatic compounds (A). |