abstract |
The present invention can continuously ensure excellent reliability as a hardened product such as high rigidity or excellent TCT resistance, and provides a curable resin composition excellent in B-HAST resistance and PCT resistance performance, a dry film using the same, and a cured product And printed wiring board. The invention includes (A) a carboxyl group-containing resin, (B) an epoxy resin having a dicyclopentadiene skeleton, (C) a photopolymerization initiator, and (D) spherical silica, wherein (D) ball The content of the shaped silicon dioxide is 50% by mass or more of the curable resin composition in the non-volatile content of the composition, the dry film, the cured product and the printed wiring board using the same. |