| abstract |
The present invention provides an acid group-containing (meth)acrylate resin composition, a curable resin composition containing the same, a cured product, an insulating material composed of the aforementioned curable resin composition, a solder resist resin material, and a solder resist member It is characterized in that the acid group-containing (meth)acrylate resin composition contains a polymerizable unsaturated bond-containing aromatic ester compound (A) and an acid group-containing (meth)acrylate resin (B). This acid group-containing (meth)acrylate resin composition can form a hardened product with high light sensitivity, excellent heat resistance, and dielectric properties. |