http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202002738-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1208 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2019-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_050f6e49c593c0ce06c128956e664739 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_685f827b129d947e0237952b061240c8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa4ec60f2080d3403672ff26bd80510c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae135272847ed44ca19fafac0ff60147 |
| publicationDate | 2020-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202002738-A |
| titleOfInvention | Printed wiring board manufacturing method |
| abstract | The invention provides a method for manufacturing a printed wiring board having a circuit pattern on an insulating substrate, which includes: Step 1: forming a silver particle layer in the range of 0.01 to 0.5 g/m 2 on the insulating substrate (A) (M1); Step 2, forming a resist pattern on the silver particle layer (M1) with the resist removed from the circuit forming portion; Step 3, forming the conductor circuit layer (M2) by plating; and Step 4 , The resist pattern is peeled off, and the silver particle layer (M1) of the non-circuit forming portion is removed by the etching solution. This manufacturing method does not require surface roughening using chromic acid or permanganic acid, surface modification layer formation using alkali, etc., and a printed wiring board can be obtained without using a vacuum device, and the obtained printed wiring board has a base material and The conductor circuit has higher adhesion and has a rectangular cross-sectional shape with less undercuts as a good circuit wiring. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112271135-A |
| priorityDate | 2018-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 272.