http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202001007-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ed77c3dbf88ed2c540f63dd17564661 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
filingDate | 2018-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60cfffcd6207a5c924d33c3d8170d721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dc3efb1e4c549050cffc083798ab565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5af5551147b7733a7199402d4d988015 |
publicationDate | 2020-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-202001007-A |
titleOfInvention | Titanium cathode surface modification method for electroplating low-roughness copper foil |
abstract | A titanium cathode surface modification method for electroplating a low-roughness copper foil includes: step 1: providing a titanium cathode which has a surface that may be unmodified, chemically modified, or physically modified; step 2: precipitating a conductive layer on the surface of the titanium cathode via an electroplating procedure; step 3, subjecting the conductive layer via an etching procedure to form an etching film; step 4: precipitating another one conductive layer on the surface of the etching film via a electroplating step; step 5: repeating step 3 and step 4 at least once. According to the method of the present invention, a titanium cathode with significantly improved surface brightness and greatly reduced roughness can be obtained, and raw copper foil with smooth surface and low roughness can be electroplated and precipitated. |
priorityDate | 2018-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.