http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202001007-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
filingDate 2018-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60cfffcd6207a5c924d33c3d8170d721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dc3efb1e4c549050cffc083798ab565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5af5551147b7733a7199402d4d988015
publicationDate 2020-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202001007-A
titleOfInvention Titanium cathode surface modification method for electroplating low-roughness copper foil
abstract A titanium cathode surface modification method for electroplating a low-roughness copper foil includes: step 1: providing a titanium cathode which has a surface that may be unmodified, chemically modified, or physically modified; step 2: precipitating a conductive layer on the surface of the titanium cathode via an electroplating procedure; step 3, subjecting the conductive layer via an etching procedure to form an etching film; step 4: precipitating another one conductive layer on the surface of the etching film via a electroplating step; step 5: repeating step 3 and step 4 at least once. According to the method of the present invention, a titanium cathode with significantly improved surface brightness and greatly reduced roughness can be obtained, and raw copper foil with smooth surface and low roughness can be electroplated and precipitated.
priorityDate 2018-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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