http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202000998-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ed77c3dbf88ed2c540f63dd17564661 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12993 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12431 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
filingDate | 2018-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60cfffcd6207a5c924d33c3d8170d721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3105d5ced1b0df86e45aa3146fc4f1d4 |
publicationDate | 2020-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-202000998-A |
titleOfInvention | Method for manufacturing copper foil with rough surface in single plating tank and its product |
abstract | A method for manufacturing a copper foil with a rough surface in a single plating tank is disclosed. In the plating tank, an electrolyte solution is delivered between an anode and a cathode with a current density of 5 ASF - 40 ASF. The copper foil with a rough surface is formed on the anode. The rough surface includes dense nodules of single copper crystals. The electrolyte solution includes chloride ions (20 ppm - 80 ppm), polyethylene glycol (PEG) with a molecular weight of 400 - 8000 (100 ppm - 700 ppm), sulfuric acid (20 g/L - 200 g/L), a copper ion source (70 g/L - 320 g/L) and a sulfur compound (1 ppm - 60 ppm). |
priorityDate | 2018-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.