http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202000998-A

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filingDate 2018-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60cfffcd6207a5c924d33c3d8170d721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3105d5ced1b0df86e45aa3146fc4f1d4
publicationDate 2020-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202000998-A
titleOfInvention Method for manufacturing copper foil with rough surface in single plating tank and its product
abstract A method for manufacturing a copper foil with a rough surface in a single plating tank is disclosed. In the plating tank, an electrolyte solution is delivered between an anode and a cathode with a current density of 5 ASF - 40 ASF. The copper foil with a rough surface is formed on the anode. The rough surface includes dense nodules of single copper crystals. The electrolyte solution includes chloride ions (20 ppm - 80 ppm), polyethylene glycol (PEG) with a molecular weight of 400 - 8000 (100 ppm - 700 ppm), sulfuric acid (20 g/L - 200 g/L), a copper ion source (70 g/L - 320 g/L) and a sulfur compound (1 ppm - 60 ppm).
priorityDate 2018-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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