| abstract |
[Problem] To provide a polishing composition capable of polishing silicon oxycarbide (SiOC) at a higher polishing rate relative to the polishing rate of silicon nitride (that is, a high polishing selection ratio of silicon oxycarbide / silicon nitride) . [Solution Means] A polishing composition is provided, which includes gold flat sugar-like silica particles and a dispersion medium, and has a pH of less than 5. |