| abstract |
The embodiment of the present invention discloses a package and a method for forming the same. A method for forming a package includes forming a die, the die including a pad and a passivation layer on the pad. A through-hole is formed through the passivation layer all the way to the pad. A solder cap is formed on the through hole, wherein a first material of the solder cap flows to a sidewall of the through hole. In some embodiments, the through-holes are encapsulated in a first encapsulation body, wherein the first encapsulation body is a polymer or molding compound selected to have a low thermal expansion coefficient and / or a low curing temperature. In some embodiments, the first material of the solder cap is removed from the sidewall of the through hole by an etching process and the through hole is encapsulated in the first encapsulation body. |