http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201943829-A

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filingDate 2019-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c7a27dfeb47ab86a0e868dcc4ee55a7
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publicationDate 2019-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201943829-A
titleOfInvention Chemical mechanical polishing composition and polishing method
abstract The present invention provides a chemical mechanical polishing composition that suppresses the generation of ruthenium tetroxide, which is highly toxic to the human body, can perform high-speed polishing of a semiconductor substrate (especially a substrate containing a ruthenium film), and can reduce abrasion damage to a polished surface, and Use its grinding method. The composition for chemical mechanical polishing of the present invention contains (A) titanium oxide-containing particles and (B) an organic acid. Among the (A) titanium oxide-containing particles, the diffraction intensity in the powder X-ray diffraction pattern is maximized. The half-value width of the peak portion of is less than 1 °.
priorityDate 2018-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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