http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201943789-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2018-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_322dc8635973c69cd3720f0a9193076f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f87ccf27aeba798575682aa7cec51dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca0c3664395756e233ebb86de229f04f |
| publicationDate | 2019-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201943789-A |
| titleOfInvention | Sealing resin composition, electronic component device, and manufacturing method of electronic component device |
| abstract | The resin composition for sealing includes (A) an epoxy resin, (B) a hardener having at least one amine group in one molecule, and (C) an inorganic filler, the (C) inorganic filler comprising (C1) average particles The first inorganic filler having a diameter of 0.1 μm to 20 μm and the second inorganic filler (C2) having an average particle diameter of 10 nm to 80 nm. The mass of the (C) inorganic filler accounts for the mass of the solid content. The value obtained by multiplying the ratio by the specific surface area of the inorganic filler (C) is 4.0 m 2 / g or more. |
| priorityDate | 2018-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.