| abstract |
The present invention provides a novel compound excellent in heat resistance and a composition containing it that can be preferably used as a material for an insulating film in electronic parts and the like. A urea-bonded tetrafunctional (meth) acrylate compound, which is represented by the following formula (1). (In formula (1), A is a divalent organic group, Y is a straight-chain alkylene group having 1 to 18 carbon atoms or a branched alkylene group, when the carbon number of the alkylene group is 2 or more , An oxygen atom (-O-) can be inserted between any CC bonds, and -CO- can be inserted between the CN bonds at the end, m is 0 or 1, X is a group represented by the following formula (2)) (In formula (2), R 1 and R 2 are independently hydrogen or methyl) |