abstract |
The present invention provides a thermosetting resin composition, a prepreg formed by containing the thermosetting resin composition, a resin-attached metal foil made by laminating the thermosetting resin composition and a metal foil, and containing the foregoing. The thermosetting resin composition can be formed from a prepreg or a laminated body made of the resin-attached metal foil, a printed wiring board containing the laminated body, and a semiconductor package containing the printed wiring board. A prepreg has low elasticity, high heat resistance, high elongation under normal temperature and high temperature environments, high electrical insulation reliability, high adhesion strength with metal foil, and excellent crack resistance. The said thermosetting resin composition is a thermosetting resin composition containing the (A) phenol resin specifically, The said (A) component contains (A-1) and has a carbon number of 10- 25 aliphatic hydrocarbon-based phenol resin. |